Evaluation of performance of Microprocessors of CPU-GPU CUDA architecture and EDA challenges facing Future Microprocessor Design

Authors

  • Numan S Dept. of Computer Science, Rizvi College of Engineering, Mumbai, India
  • Haider SS Dept. of Computer Science, Rizvi College of Engineering, Mumbai, India
  • Rwitobaan S Dept. of Computer Science, Rizvi College of Engineering, Mumbai, India
  • Shakila S Dept. of Computational Sciences, Rizvi College of Engineering, Mumbai, India
  • Pappu S Dept. of Computational Sciences, Rizvi College of Engineering, Mumbai, India

DOI:

https://doi.org/10.26438/ijcse/v7i10.177181

Keywords:

GPU, Cuda cores, Thermal

Abstract

To increase the processor speed and its respective performance a more streamlined method of approach was required. Electronic Design Automation (EDA) is implemented. This article describes the changes brought about by EDA in the development of microprocessor systems and the challenges faced by EDA currently and in the future. This article will also describe the various tests and experiments conducted on the CUDA architecture based microprocessor and also highlight the overall performance and thermals of the system under such extreme test conditions.

References

[1] Cuda Architecture Link:http://developer.download.nvidia.com/compute/cuda/docs/CUDA_Architecture_Overview.pdf

[2] Electronic Design Automation

Link:https://www.sciencedirect.com/topics/engineering/electronic-design-automation

[3] The End of Moore’s Law?

Link:https://www.technologyreview.com/s/400710/the-end-of-moores-law/

[4]Transient Thermal Analysis of a Microprocessor using a heat spreader with variable thermal storage characteristics

Link:https://www.researchgate.net/publication/229050507_Transient_thermal_analysis_of_a_microprocessor_using_a_heat_spreader_with_variable_thermal_storage_characteristics

[5]Temperature sensitive microprocessor design

Link:https://pdfs.semanticscholar.org/afea/435fc7fb23ba7b31dc4c4bc75840b0470e20.pdf

[6] Tiwari, R. Sam and S. Shaikh, "Analysis and prediction of churn customers for telecommunication industry," 2017 International Conference on I-SMAC (IoT in Social, Mobile, Analytics and Cloud) (I-SMAC), Palladam, 2017, pp. 218-222. doi: 10.1109/I-SMAC.2017.8058343

[7] S Navadia, P. Yadav, J. Thomas and S. Shaikh, "Weather prediction: A novel approach for measuring and analyzing weather data," 2017 International Conference on I-SMAC (IoT in Social, Mobile, Analytics and Cloud) (I-SMAC),

Palladam, 2017, pp. 414-417. doi: 10.1109/I-SMAC.2017.8058382

[8] S. Shaikh, S. Rathi and P. Janrao, "IRuSL: Image Recommendation Using Semantic Link," 2016 8th International Conference on Computational Intelligence and Communication Networks (CICN), Tehri, 2016, pp. 305-308. doi: .1109/CICN.2016.6

[9] S. Shaikh, S. Rathi and P. Janrao, "Recommendation System in E-Commerce Websites: A Graph Based Approached," 2017 IEEE 7th International Advance Computing Conference (IACC), Hyderabad, 2017, pp. 931-934. doi: 10.1109/IACC.2017.0189

[10] A. Fasiku, Ayodeji Ireti, B. Olawale, Jimoh Babatunde, C. Abiola Oluwatoyin B., "Comparison of Intel Single-Core and Intel Dual-Core Processor Performance", International Journal of Scientific Research in Computer Science and Engineering, Vol.1, Issue.1, pp.1-9, 2013

[11] M. Sora, J. Talukdhar, S. Majumder, P.H Talukdhar, U.Sharmah, "Word level detection of Galo and Adi language using acoustical cues", International Journal of Scientific Research in Computer Science and Engineering, Vol.1, Issue.1, pp.10-13, 2013

[12] Manish Mishra, Piyush Shukla, Rajeev Pandey, "Assessment on different tools used for Simulation of routing for Low power and lossy Networks(RPL)", International Journal of Scientific Research in Network Security and Communication, Vol.7, Issue.4, pp.26-32, 2019.

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Published

2019-10-31
CITATION
DOI: 10.26438/ijcse/v7i10.177181
Published: 2019-10-31

How to Cite

[1]
S. Numan, S. S. Haider, S. Rwitobaan, S. Shakila, and S. Pappu, “Evaluation of performance of Microprocessors of CPU-GPU CUDA architecture and EDA challenges facing Future Microprocessor Design”, Int. J. Comp. Sci. Eng., vol. 7, no. 10, pp. 177–181, Oct. 2019.

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Section

Research Article