VR4DT: Virtual Reality for Driving Test

Authors

  • Swarnkar N Department of Computer Engineering, Late G.N Sapkal College of Engineering , Nashik, India
  • Singh Chug I Department of Computer Engineering, Late G.N Sapkal College of Engineering , Nashik, India
  • Bagwan F Department of Computer Engineering, Late G.N Sapkal College of Engineering , Nashik, India
  • Thorat G Department of Computer Engineering, Late G.N Sapkal College of Engineering , Nashik, India

Keywords:

Virtual Reality, Google Cardboard, Virtual Reality Driving Simulator, R.T.O Testing, Driver Performance

Abstract

In this paper the virtual reality augmented R.T.O. testing with an interactive virtual environment is presented. It was designed as a modular system that can convert a car using Google Cardboard to in virtual reality (VR) car. Novel hardware components embedded with sensors were implemented on stationary car to monitor driver performance while immersing them in a virtual reality driving simulator providing to driver with visual and hepatic feedback.

References

Richard Ranky, Mark Sivak, Jeffrey Lewis,Venkata Gade, Judith E. Deutsch and Constantinos Mavroidis VRACK - VirtualReality Augmented Cycling Kit: Design and Validation IEEE Virtual Reality 2010. 20 - 24 March.

Akinwuntan, A. E. De Weerdt, W. Feys, H., De Vooght, F.Devos, H. Baten, G. et al. (2007). Training of driving-related attentional performance after stroke using a driving simulator.

Elizabeth H. Oakes (2007) Encyclopedia of World Scientist Info Base Publishing. p. 701. ISBN 978-1-4381-1882-6.Retrieved 16 August 2012

J. Caviedesand, J. Villegas, “Real time 2D to 3D conversion: Technical and visual quality requirements,” IEEE International Conference on Consumer Electronics, pp. 897-898, 2011.

Dougherty, Conor (May 28, 2015) “Google Intensifies Focus on its Cardboard Virtual Reality Device “Retrieved June 17, 2015

Downloads

Published

2025-11-10

How to Cite

[1]
N. Swarnkar, I. Singh Chug, F. Bagwan, and G. Thorat, “VR4DT: Virtual Reality for Driving Test”, Int. J. Comp. Sci. Eng., vol. 3, no. 9, pp. 210–213, Nov. 2025.